Tvs diode arrays, Low capacitance esd protection - sp3010 series, Diodes) – Littelfuse SP3010 Series User Manual
Page 4
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3010 Series
Embossed Carrier Tape & Reel Specification — µDFN-10
Package Dimensions — µDFN-10 (2.5x1.0x0.5mm)
Package
µ
DFN-10 (2.5x1.0x0.5mm)
Symbol
Millimeters
A0
1.30 ± 0.10
B0
2.83 ± 0.10
D0
Ø 1.50 + 0.10
D1
Ø 1.00 + 0.25
E
1.75 ± 0.10
F
3.50 ± 0.05
K0
0.65 ± 0.10
P0
4.00 ± 0.10
P1
4.00 ± 0.10
P2
2.00 ± 0.05
T
0.254 ± 0.02
W
8.00 + 0.30 /- 0.10
K0
A0
B0
P2
P1
P0
T
F
E
W
D0
D1
5º Max
5º Max
User Feeding Direction
Pin 1 Location
Package
µ
DFN-10 (2.5x1.0x0.5mm)
JEDEC
MO-229
Symbol
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A
0.48
0.515
0.55
0.019
0.020
0.021
A1
0.00
--
0.05
0.000
0.022
A3
0.125 Ref
0.005 Ref
b
0.15
0.20
0.25
0.006
0.008
0.012
b1
0.35
0.40
0.45
0.014
0.016
0.018
D
2.40
2.50
2.60
0.094
0.098
0.102
E
0.90
1.00
1.10
0.035
0.039
0.043
e
0.50 BSC
0.020 BSC
L
0.30
0.365
0.43
0.012
0.014
0.016
D
E
B
Top View
A
A
Bottom View
0.05 C
b
A1
b1
A3
C
Seating
Plane
Side View
0.10
C A
M
B
0.05
C
M
L
e
2xR0.075mm (7x)
R0.125
0.05 C
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Recomended
D
E
B
Top View
A
A
Bottom View
0.05 C
b
A1
b1
A3
C
Seating
Plane
Side View
0.10
C A
M
B
0.05
C
M
L
e
2xR0.075mm (7x)
R0.125
0.05 C
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Recomended
Soldering Pad Layout Dimensions
Inch
Millimeter
C
(0.034)
(0.875)
G
0.008
0.20
P
0.020
0.50
P1
0.039
1.00
X
0.008
0.20
X1
0.016
0.40
Y
0.027
0.675
Y1
(0.061)
(1.55)
Z
0.061
1.55
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Alternative