OSRAM ORBEOS Components - Manual (Page 9)

9
OLED INTEGRATION
Flex-PCBs are applied by a special conductive polymer mate-
rial in a thermo-compression process called ACF bonding
(anisotropic conductive fi lm bonding), which is well known
from the display industry: First, a two-component material is
dispensed at the contact pad of the OLED. Then, the Flex-PCB
is adjusted to the contact pad. Afterwards, heat and pressure
is applied on the connection by a heated stamp (bonding
tool, fi gure 7).
ORBEOS ® devices are available with PCB. In case an indivi-
dual PCB design is desired, and for more details on the
material and process conditions, the following links regarding
ACF may be helpful:
http://www.hitachi-chem.co.jp/english/products/do/001.html
http://www.sonycid.jp/en/products/dd1/
For more details on ACF/heatseal bonding equipment, please
refer to, e.g.:
http://www.miyachieurope.com/products/hot-bar/
Fig. 7. Application of Flex-PCB on the OLED contacts via ACF bonding.
Thermal management:
Heat sinks as known from LED technology are not obligatory, since
OLEDs are cooled passively by heat convection and radiation from
both of their surfaces. A device, which is driven at typical operation
conditions (1000 cd/m 2 luminance), heats up by between 5 K and
15 K above ambient temperature. In general, the design of the OLED
application should enable suffi cient heat transport from the surfaces.
Please also see the section: 4.2.2. Ambient temperature.