GE Industrial Solutions EBVW025A0B Barracuda Series - Manual (Page 10)

GE
Data Sheet
EBVW025A0B Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 12.0Vdc, 25.0A, 300W Output
April 15, 2013 ©2012 General Electric Company. All rights reserved. Page 10
Feature Descriptions (continued)
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature, the
module output power is increased, until one (or more) of the
components reaches its maximum derated operating
temperature, as defined in IPC-9592. This procedure is then
repeated for a different airflow or ambient temperature until a
family of module output derating curves is obtained.
Heat-dissipating components are mounted on the top side of
Heat-dissipating components are mounted on the top side of
the module. Heat is removed by conduction, convection and
radiation to the surrounding environment. Proper cooling can
be verified by measuring the thermal reference temperature
(TH
x
). Peak temperature (TH
x
) occurs at the position indicated in
Figure 18 and 19. For reliable operation this temperature
should not exceed the listed temperature threshold.
Figure 18. Location of the thermal reference temperature
TH
1
. Do not exceed 113 °C.
Figure 19. Location of the thermal reference temperature
TH
2
for Base Plate module. Do not exceed 110 °C.
The output power of the module should not exceed the rated
power for the module as listed in the Ordering Information
table.
Although the maximum temperature of the power modules is
TH
x
, you can limit this temperature to a lower value for
extremely high reliability.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. The thermal derating of figures 20 through 22
show the maximum output current that can be delivered by
each module in the indicated orientation without exceeding
the maximum TH
x
temperature versus local ambient
temperature (T
A
) for air flows of, Natural Convection, 1 m/s (200
ft./min), 2 m/s (400 ft./min).
The use of Figures 20 is shown in the following example:
Example
What is the minimum airflow necessary for a EBVW025A0B
operating at V
I
= 48 V, an output current of 14A, and a
maximum ambient temperature of 70 °C in transverse
orientation.
Solution:
Given: V
in
= 48V, I
O
= 14A, T
A
= 70 °C
Determine required airflow (V) (Use Figure 20):
V = 200LFM or greater.
OUTP
U
T CU
RRENT, I
O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
(C)
Figure 20. Output Current Derating for the Open Frame
EBVW025A0B in the Transverse Orientation; Airflow Direction
from Vin(-) to Vin(+); Vin = 48V.