GE Industrial Solutions Austin Minilynx 12V SIP - Manual (Page 15)

Data Sheet
October 2, 2009 Austin MiniLynx TM 12V SIP Non-isolated Power Modules:
8.3 – 14Vdc Input; 0.75Vdc to 5.5Vdc Output; 3A output current
LINEAGE POWER 15
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have an RoHS-compliant
finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat
rate of 3
°C/s is suggested. The wave preheat
process should be such that the temperature of the
power module board is kept below 210
°C. For Pb
solder, the recommended pot temperature is
260
°C, while the Pb-free solder pot is 270°C max.
Not all RoHS-compliant through-hole products can
be processed with paste-through-hole Pb or Pb-
free reflow process. If additional information is
needed, please consult with your Lineage Power
technical representative for more details.