GE Industrial Solutions ESTW004A2C Series - Manual (Page 10)

Data Sheet
August 30, 2011
ESTW004A2C Series DC-DC Converter Power Modules
36–75V
dc
Input; 15.0V
dc
/4.2A
dc
Output
LINEAGE POWER 10
Surface Mount Information
Pick and Place
The ESTW004A2C modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 18. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
The surface mountable modules in the ESTW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 19 shows the new CP
connector before and after reflow soldering onto the
end-board assembly. The CP is constructed from a
solid copper pin with an integral solder ball attached,
which is composed of tin/lead (Sn/Pb) solder for non-
Z codes, or Sn/Ag
3
/Cu (SAC) solder for –Z codes.
Figure 19. Column Pin Connector Before and After
Reflow Soldering .
The CP connector design is able to compensate for
large amounts of co-planarity and still ensure a
reliable SMT solder joint. Typically, the eutectic solder
melts at 183
o C (Sn/Pb solder) or 217-218 o C (SAC
solder), wets the land, and subsequently wicks the
device connection. Sufficient time must be allowed to
fuse the plating on the connection to ensure a reliable
Tin Lead Soldering
The ESTW004A2C power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o C. Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The –Z version of the ESTW004A2C modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.