GE Industrial Solutions 16V PicoTLynx 4A - Manual (Page 25)

GE
Data Sheet
16V PicoTLynx TM 4A: Non-Isolated DC-DC Power Modules
8Vdc –16Vdc input; 0.6Vdc to 8.0Vdc output; 4A Output Current
September 10, 2013 ©2013 General Electric Company. All rights reserved. Page 25
Surface Mount Information
Pick and Place
The 16V PicoTLynx TM 4A modules use an open frame
construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to
provide a large surface area for pick and place operations. The
label meets all the requirements for surface mount processing,
as well as safety standards, and is able to withstand reflow
temperatures of up to 300 o C. The label also carries product
information such as product code, serial number and the
location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered
to optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process. If assembly on the bottom side is planned, please
contact Lineage Power for special manufacturing process
instructions.
Only ruggedized (-D version) modules with additional epoxy will
work with a customer’s first side assembly. For other versions,
first side assembly should be avoided
Lead Free Soldering
The 16V PicoTLynx TM 4A modules are lead-free (Pb-free) and
RoHS compliant and fully compatible in a Pb-free soldering
process. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder profiles
and MSL classification procedures. This standard provides a
recommended forced-air-convection reflow profile based on
the volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Fig. 62. Soldering outside of the recommended profile
requires testing to verify results and performance. For
questions regarding Land grid array(LGA) soldering, solder
volume; please contact Lineage Power for special
manufacturing process instructions
MSL Rating
The 16V PicoTLynx TM 4A modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should not be
broken until time of use. Once the original package is broken,
the floor life of the product at conditions of
≤ 30°C and 60%
relative humidity varies according to the MSL rating (see J-STD-
033A). The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when stored at
the following conditions: < 40° C, < 90% relative humidity.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure
62. Recommended linear reflow profile using Sn/Ag/Cu
solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability of
a power module and the testability of the finished circuit-board
assembly. For guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power Modules:
Soldering and Cleaning Application Note (AN04-001).