GE Industrial Solutions ESTW025A0F Series - Manual (Page 10)

Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 10
Surface Mount Information
Pick and Place
The ESTW025A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 18. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The ESTW025A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o C. Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
R
E
FLOW
TE
MP
(
C)
REFLOW TIME (S)
Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)
process.
M
AX TE
M
P
S
O
LD
ER
(
C)
Figure 20. Time Limit Curve Above 205
o
C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the ESTW025A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Reflow Soldering Information
The surface mountable modules in the
ESTW025A0F-S family use our newest SMT
0
50
100
150
200
250
300
P reheat zone
max 4
o Cs -1
Soak zone
30-240s
Heat zone
max 4
o Cs -1
P eak Temp 235 o C
Cooling
zone
1-4
o Cs -1
T
lim
above
205 o C
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60