36v prolynx, 3a: non-isolated dc-dc power modules, Data sheet – GE Industrial Solutions 9-36V ProLynx 3A User Manual

Page 21: Surface mount information

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GE

Data Sheet

9-36V ProLynx

TM

3A: Non-Isolated DC-DC Power Modules

9Vdc –36Vdc input; 3Vdc to 18Vdc output; 3A to 1.5A Scaled output current

9Vdc –24Vdc input; -3.3Vdc to -12Vdc output; 3A to 0.7A Scaled output current

July 23, 2013

©2013 General Electric Company. All rights reserved.

Page 21

Surface Mount Information

Pick and Place

The 9-36V ProLynx

TM

modules use an open frame construction

and are designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a large
surface area for pick and place operations. The label meets all

the requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow temperatures
of up to 300

o

C. The label also carries product information such

as product code, serial number and the location of
manufacture.

Nozzle Recommendations

The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered
to optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.

Bottom Side / First Side Assembly

This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process.

Lead Free Soldering

The 9-36V ProLynx

TM

modules are lead-free (Pb-free) and RoHS

compliant and fully compatible in a Pb-free soldering process.
Failure to observe the instructions below may result in the

failure of or cause damage to the modules and can adversely
affect long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid

State Surface Mount Devices) for both Pb-free solder profiles
and MSL classification procedures. This standard provides a
recommended forced-air-convection reflow profile based on

the volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The

recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Fig. 41.

Soldering outside of the recommended profile

requires testing to verify results and performance.
For questions regarding Land grid array(LGA) soldering, solder
volume; please contact Lineage Power for special
manufacturing process instructions.

MSL Rating

The 9-36V ProLynx

TM

modules have a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is

detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).

Moisture barrier bags (MBB) with desiccant are required
for MSL ratings of 2 or greater. These sealed packages

should not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of

≤ 30°C and 60% relative humidity varies

according to the MSL rating (see J-STD-033A). The shelf

life for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the
following conditions: < 40° C, < 90% relative humidity.

Figure 41. Recommended linear reflow profile using
Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board

assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both

the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,

refer to Board Mounted Power Modules: Soldering and
Cleaning
Application Note (AN04-001).

Per J-STD-020 Rev. C

0

50

100

150

200

250

300

Reflow Time (Seconds)

R

efl

ow

T

em

p

C

)

Heating Zone
1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Seconds

Cooling
Zone

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