GE Industrial Solutions KHHD015A0F Hammerhead Series - Manual (Page 11)

GE Data Sheet
KHHD015A0F Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 12A/15A Output
April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Surface Mount Information (continued)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The KHHD015A0F series SMT modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of  30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to GE Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AP01-056EPS).
Pe r J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
o
w
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone