GE Industrial Solutions KHHD006A0A Hammerhead Series - Manual (Page 9)

GE Data Sheet
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
September 26, 2013 ©2013 General Electric Corporation. All rights reserved. Page 9
Thermal Considerations (continued)
OUTPUT CU
RRE
NT, I
O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
( °C)
Figure 14. Output Current Derating for the Open Frame
KHHD006A0A in the Transverse Orientation; Airflow
Direction from Vin(+) to Vin(-); Vin = 24V.
OUTPUT CU
RRE
NT, I
O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
( °C)
Figure 15. Output Current Derating for the Open Frame
KHHD006A0A in the Transverse Orientation; Airflow
Direction from Vin(+) to Vin(-); Vin = 48V.
The thermal reference point, T
ref,
used in the specifications is
shown in Figure 16. For reliable operation this temperature
should not exceed 135 o C.
Figure 16. T
ref
Temperature Measurement Location.
EMC Requirements
Figure 17 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1 and C4 are low impedance SMT ceramics.
Ci See Figure 7
C1, C4 2.2uF, 100V, 1210
C2, C3 1210Y1K50103KXTDWV, 10nF, 1500V (*2)
RDHX223K302HKT, 22nF, 3000V (Holystone)
C5, C6
GRM32DR73A153KW01L, 15nF, 1000V (*2)
RDHX333K302HKT, 33nF, 3000V (Holystone)
202S48W334KT, 33nF, 2000V (Johanson)
Figure 17. Suggested Configuration for EN55022 Class B.
Figure 18. EMC signature using above filter, KHHD006A0A.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The KHHD006A0A power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The KHHD006A0A family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT) soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an