GE Industrial Solutions Naos Raptor 50A - Manual (Page 12)

Data Sheet
October 31, 2011 Naos Raptor 50A: Non Isolated Power Module:
5 – 14Vdc input; 0.6Vdc to 2.0Vdc Output; 50A output current
LINEAGE POWER 12
Thermal Considerations
Power modules operate in a variety of thermal
environments; however sufficient cooling should
always be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown in Figure 26. The preferred airflow
direction for the module is in Figure 27.
Figure 26. Thermal Test Set-up.
The thermal reference points, T
ref1
and T
ref2
used in
the specifications are shown in Figure 27. For reliable
operation the temperature at T
ref1
should not exceed
120 o C, and the temperature at T
ref2
should not exceed
105 o C. Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
The output power of the module should not exceed
the rated power of the module (Vo,set x Io,max).
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Figure 27. Temperature measurement locations
T
ref1
and T
ref2
.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260 °C, while the Pb-free solder pot is
270 °C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Air
Flow
Power Module
Wind Tunnel
PWBs
7.24
[0.285]
76.2
[3.0] Probe Location
for measuring
airflow and
ambient
temperature
50.8
[2.00]