Data sheet, Thermal considerations (continued), Emc requirements – GE Industrial Solutions KSTW010A0F Barracuda Series User Manual

Page 9: Layout considerations

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GE

Data Sheet

KSTW010A0F Barracuda* Series; DC-DC Converter Power Modules

36-75Vdc Input; 3.3Vdc, 10A Output

September 26, 2013

©2013 General Electric Corporation. All rights reserved.

Page 9

Thermal Considerations (continued)

O

U

TP

U

T

C

U

RR

EN

T,

I

O

(A)

LOCAL AMBIENT TEMPERATURE, T

A

(

C)

Figure 14. Output Current Derating for the Open Frame
KSTW010A0F in the Transverse Orientation; Airflow
Direction from Vin(+) to Vin(-); Vin = 48V.


The thermal reference point, T

ref,

used in the specifications is

shown in Figure 15. For reliable operation this temperature
should not exceed 111

o

C.

Figure 15. T

ref

Temperature Measurement Location.

EMC Requirements

Figure 16 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.

Notes: C1 and C4 are low impedance SMT ceramics.

Ci

See Figure 7

C1, C4

2.2uF, 100V, 1210

C2, C3

1210Y1K50103KXTDWV, 10nF, 1500V (*2)
RDHX223K302HKT, 22nF, 3000V (Holystone)

C5, C6

GRM32DR73A153KW01L, 15nF, 1000V (*2)
RDHX333K302HKT, 33nF, 3000V (Holystone)
202S48W334KT, 33nF, 2000V (Johanson)

Figure 16. Suggested Configuration for EN55022 Class B.

Figure 17. EMC signature using above filter, KSTW010A0F.

For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).

Layout Considerations

The KSTW010A0F power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.

For additional layout guide-lines, refer to the FLTR100V10 data
sheet.

The KSTW010A0F family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT) soldering.

Through-Hole Soldering Information

The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an

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