GE Industrial Solutions KNW013-020 (Sixteenth-Brick) - Manual (Page 11)

Data Sheet
August 22, 2011
KNW013-020 Series Power Modules; DC-DC Converters
36 – 75V
dc
Input; 3.3 to 5.0V
dc
Output; 13 to 20A Output Current
LINEAGE POWER 11
Surface Mount Information
Pick and Place
The KNW013-020 modules use an open frame
construction and are designed for a fully automated
assembly process. The pick and place locations on
the module are the larger magnetic core or the
transistor package as shown in Figure 22. The
modules are fitted with a label which meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 22. Pick and Place Locations.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 5mm. Oblong or oval nozzles up to 11 x 5
mm may also be used within the space available.
Tin Lead Soldering
The KNW013-020 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KNW013-020 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o C. Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
R
E
FLOW
TE
MP
(
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
So ak zo ne
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Coo ling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process
M
AX TE
M
P
S
O
LD
ER
(
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 24. Time Limit Curve Above 205 o C for
Tin/Lead (Sn/Pb) process