GE Industrial Solutions 3A Analog PicoDLynx - Manual (Page 16)

GE
Preliminary Data Sheet
3A Analog PicoDLynx TM : Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 3A Output Current
December 7, 2012 ©2012 General Electric Company. All rights reserved. Page 16
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will result
in an increase in reliability. The thermal data presented here is
based on physical measurements taken in a wind tunnel. The
test set-up is shown in Figure 46. The preferred airflow
direction for the module is in Figure 47.
Air
flow
x
Power Module
Wind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Figure 46. Thermal Test Setup.
The thermal reference points, T
ref
used in the specifications are
also shown in Figure 47. For reliable operation the
temperatures at these points should not exceed 120
o C. The
output power of the module should not exceed the rated power
of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Figure 47. Preferred airflow direction and location of
hot-spot of the module (Tref).