Thermal considerations, 12a analog picodlynx, Non-isolated dc-dc power modules – GE Industrial Solutions 12A Analog PicoDLynx User Manual

Page 16: Data sheet

Advertising
background image

GE

Data Sheet

12A Analog PicoDLynx

TM

: Non-Isolated DC-DC Power Modules

3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 12A Output Current

August 13, 2013

©2013 General Electric Corporation. All rights reserved.

Page 16

Thermal Considerations

Power modules operate in a variety of thermal environments;

however, sufficient cooling should always be provided to help

ensure reliable operation.
Considerations include ambient temperature, airflow, module

power dissipation, and the need for increased reliability. A

reduction in the operating temperature of the module will result

in an increase in reliability. The thermal data presented here is

based on physical measurements taken in a wind tunnel. The

test set-up is shown in Figure 46. The preferred airflow

direction for the module is in Figure 47.

Air

flow

x

Power Module

Wind Tunnel

PWBs

12.7_

(0.50)

76.2_

(3.0)

Probe Location

for measuring

airflow and

ambient

temperature

25.4_

(1.0)

Figure 46. Thermal Test Setup.


The thermal reference points, T

ref

used in the specifications are

also shown in Figure 45. For reliable operation the temperature

at Q1 should not exceed 120

o

C and the temperature at L1

should not exceed 130

o

C. The output power of the module

should not exceed the rated power of the module (Vo,set x

Io,max).
Please refer to the Application Note “Thermal Characterization

Process For Open-Frame Board-Mounted Power Modules” for a

detailed discussion of thermal aspects including maximum

device temperatures.








Figure 47. Preferred airflow direction and location of

hot-spot of the module (Tref).

Advertising