GE Industrial Solutions NH020-Series - Manual (Page 14)

Lineage Power 14
Data Sheet
October 14, 2009
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 20 W
NH020-Series Power SIPs:
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant compo-
nents. They are designed to be processed through single or
dual wave soldering machines. The pins have an RoHS-
compliant finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat rate of 3°C/s
is suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210°C. For Pb solder, the recommended pot temper-
ature is 260°C, while the Pb-free solder pot is 270°C max.
Not all RoHS-compliant through-hole products can be pro-
cessed with paste-through-hole Pb or Pb-free reflow pro-
cess. If additional information is needed, please consult with
your Tyco Electronics Power System representative for more
details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose
nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).