GE Industrial Solutions KHHD002A5B Hammerhead Series - Manual (Page 9)

GE Data Sheet
KHHD002A5B Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 12Vdc, 2.5A Output
September 26, 2013 ©2012 General Electric Corporation. All rights reserved. Page 9
O
U
TPUT CU
RRE
NT, I
O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
( °C)
Figure 14. Output Current Derating for the Open Frame
KHHD002A5B in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 24V or 48V.
The thermal reference point, T
ref,
used in the specifications is
shown in Figure 15. For reliable operation this temperature
should not exceed 135 o C.
Figure 15. T
ref
Temperature Measurement Location.
EMC Requirements
Figure 16 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1 and C4 are low impedance SMT ceramics.
Ci See Figure 7
C1, C4 2.2uF, 100V, 1210
C2, C3 1210Y1K50103KXTDWV, 10nF, 1500V (*2)
RDHX223K302HKT, 22nF, 3kv
C5, C6 RDHX333K302HKT, 33nF, 3000V (Holystone)
202S48W334KT, 33nF, 2000V (Johanson)
Figure 16. Suggested Configuration for EN55022 Class B.
Figure 17. KHHD002A5B Vin+ Line EMC signature using
above filter, Vin=48V, Blue=PK, Red=Avg.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The KHHD002A5B power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The KHHD002A5B family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT) soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant finish that is compatible with both Pb and Pb-
free wave soldering processes. A maximum preheat rate of
3
°C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot temperature is
260 °C, while the Pb-free solder pot is 270°C max. Not all RoHS-
compliant through-hole products can be processed with paste-
through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
representative for more details.