Diodes B3L30LP - Manual (Page 2)

B3L30LP
Document number: DS30915 Rev. 11 - 2
2 of 5
www.diodes.com
March 2014
© Diodes Incorporated
B3L30LP
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage V
RRM
V
RWM
V
R
30 V
RMS Reverse Voltage V
R(RMS)
21 V
Average Rectified Output Current I
O
3.0 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
I
FSM
30 A
Thermal Characteristics
Characteristic Symbol Typ Max Unit
Thermal Resistance Junction to Soldering Point R
θJS
⎯ 3 °C/W
Thermal Resistance Junction to Ambient Air (Note 5) R
θJA
130 ⎯ °C/W
Power Dissipation
(Note 6)
(Note 7)
(Note 8)
P
D
⎯
⎯
⎯ 2.5
4.0
4.5
W
Operating and Storage Temperature Range T
J
, T
STG
-65 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 9) V
(BR)R
30 ⎯ ⎯ V I
R
= 5.0mA
Forward Voltage V
F
⎯ 0.28 ⎯
V
I
F
= 0.5A, T
J
= +25°C
⎯ 0.30 0.35 I
F
= 1.0A, T
J
= +25°C
⎯ 0.18 0.29 I
F
= 1.0A, T
J
= +125°C
⎯ 0.33 0.40 I
F
= 2.0A, T
J
= +25°C
⎯ 0.22 0.37 I
F
= 2.0A, T
J
= +125°C
⎯ 0.35 0.45 I
F
= 3.0A, T
J
= +25°C
⎯ 0.26 0.42 I
F
= 3.0A, T
J
= +125°C
Reverse Current (Note 9) I
R
⎯ 0.27 1.0 mA T
J
= +25°C, V
R
= 30V
⎯ 55 90 mA T
J
= +100°C, V
R
= 30V
Notes: 5. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com. T A = +25°C.
6. Device mounted on FR-4 PCB, 25mm 2 pad area.
7. Device mounted on FR-4 PCB, 75mm 2 pad area.
8. Aluminum PCB with copper mounting pad area of 75mm 2 .
9. Short duration pulse test used to minimize self-heating effect.