Diodes MMSTA56 - Manual

MMSTA55/MMSTA56
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
• Complementary NPN Type Available
(MMSTA05/MMSTA06)
• Ideal for Low Power Amplification and Switching
• Ultra-Small Surface Mount Package
•
Lead Free/RoHS Compliant (Note 2)
•
"Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
•
MMSTA55 Marking K2H, K2G (See Page 3)
•
MMSTA56 Marking K2G (See Page 3)
• Ordering & Date Code Information: See Page 3
• Weight: 0.006 grams (approximate)
SOT-323
Dim Min Max
A 0.25 0.40
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
E 0.30 0.40
G 1.20 1.40
H 1.80 2.20
J 0.0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.18
α
0
°
8
°
All Dimensions in mm
E B
C
A
M
J
L E D
B C
H
K
G
B E
C
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol MMSTA55 MMSTA56 Unit
Collector-Base Voltage V
CBO
-60 -80 V
Collector-Emitter Voltage V
CEO
-60 -80 V
Emitter-Base Voltage V
EBO
-4.0 V
Collector Current - Continuous (Note 1) I
C
-500 mA
Power Dissipation (Note 1) P d
200 mW
Thermal Resistance, Junction to Ambient (Note 1) R θJA 625 °C/W
Operating and Storage Temperature Range T
j
, T
STG
-55 to +150 °C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30167 Rev. 10 - 2 1 of 3
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MMSTA55/MMSTA56
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