AAEON IMBM-H61B - Manual (Page 6)

IMBM-H61B 1-2
1.3 Specifications
SYSTEM
Form factor Micro ATX
CPU LGA1155 socket for Intel ® 3rd/2nd Generation Core™ i7 / Core™ i5 /
Core™ i3 / Pentium ® / Celeron ® processors
Supports Intel ® 22nm / 32nm CPU
Supports Intel ® Turbo Boost Technology 2.0
• The Intel ® Turbo Boost Technology 2.0 support depends on the CPU types.
Memory 2 x DIMM (8GB per DIMM), max. 16GB, DDR3 1333 / 1066MHz
Dual-channel memory architecture
Chipset Intel ® H61 Express Chipset
I/O Chipset Fintech F81866D (5 COM) + 2 x Fintech 81216HD (8 COM)
Ethernet 2 x Realtek ® PCIe Gb LAN RTL8111F
BIOS 64Mb Flash ROM, UEFI AMI BIOS, PnP, DMI 2.0, SM BIOS, ACPI
2.0a
Manageability WOL by PME, PXE
OS Windows ® XP 32-bit, Windows ® 7 32/64-bit, Linux Fedora
H/W Status Monitor Monitors CPU/system temperature
Monitors Vcore, 3.3V/5V/12V voltages
Monitors CPU/chassis fan speed
Expansion slot 1 x PCI Express 2.0 x16 slot
2 x PCI slots
1 x PCI Express Mini Card slot
Battery
Lithium battery
Power requirement
1 x 24-pin ATX connector
1 x 4-pin ATX 12V power connector
1 x CPU fan
2 x Chassis fan
Board size
9.6 in. x 9.6 in. (24.4 cm x 24.4 cm)
Gross weight
1.55 lb (0.7 Kg)
Operating
temperature
32 o F~140 o F (0 o C~60 o C)
Storage temperature
-40 o F~185 o F (-40 o C~85 o C)
Operating humidity
0%~90% relative humidity, non-condensing
Power compliance
Compliant with Eup/ErP
EMI
CE (include CE-LVD), FCC
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