AAEON FSB-B75H - Manual (Page 10)

F u l l - s i z e S B C F S B - B 7 5 H
Chapter 1 General Information 1-4
1.3 Specification
System

Form Factor PICMG 1.3 Full size SBC
 Processor
Intel
®
3
rd
Generation Core
TM
i7/i5/i3 LGA
1155 Processor

System Memory 240-pin Dual-Channel DDR3 1333/1600
DIMM socket x 2, up to 16GB
 Chipset
Intel
®
B75

I/O Chipset Winbond W83627DHG-P

Ethernet Realtek 8111E 10/100/1000Base-TX,
RJ-45 x 2 on bracket

BIOS AMI Plug & Play SPI BIOS-128MB ROM

Wake on LAN Yes

H/W Status Monitoring System temperature, voltage and cooling
fan status monitoring

Expansion Interface Follow PICMG 1.3 Regulation
 Battery
Lithium battery

Power Requirement ATX 2.1

Board Size 13.3” x 5” (339mm x 126mm)

Gross Weight 1.2 lb (0.5 Kg)
 Operating
Temperature
32
o
F ~ 140
o
F (0
o
C ~ 60
o
C)
 Storage
Temperature -4
o
F ~ 158
o
F (-20
o
C ~ 70
o
C)

Operating Humidity 5%~90% resistive humidity,