Surface mounting condition, Transducer, Temperature profile for a lead-free reflow process – BeStar SMT1010-03XH05 LF User Manual
Page 5
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Approved by:
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Page:4 of 7
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
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4.Surface Mounting Condition
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to preven them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
Follwing soldering conditions are recommend;Refer to Fig.1
E
F
G
H
E
F
G
H
6
5
4
3
2
1
SMT1010-03XH05 LF
min.40s
max.255℃
T(solid)min.217
℃
max.260℃
300
250
min.300s
Temperature profile for a lead-free reflow process
max.90s
400
300
350
ramp down
from T(solid)
min.6k/s
250
150
200
time [s]
min.190℃
100
0
0
50
ramp up to
150℃
min.3k/s
T
emp
e
ra
tu
re
[
℃
]
200
100
150
50
min.110s
07.6.19
韩学慧
A
07.6.19
韩学慧
程久生
朱成兴
BS/TET01.472A
SMT1010-03XH05 LF