Silicon Power SMCT AC 65N14_N-MOS VCS, Bare Die User Manual

Smctac65n16, Solidtron, N-mos vcs, bare die

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Description

Package

Size - 6

The voltage controlled Solidtron

TM

(VCS) discharge switch is an n-

Cathode Bond Area

Solidtron

TM

N-MOS VCS, Bare Die

Data Sheet (Rev 0 - 10/28/10)

SMCTAC65N16

275 Great Valley Parkway
Malvern, PA 19355
Ph: 610-407-4700

Gate Bond

Area

Gate Return

Bond Area

The voltage controlled Solidtron

TM

(VCS) discharge switch is an n-

type MOS-Controlled Thyristor semiconductor.

The VCS features the high peak current capability and low On-
state voltage drop common to SCR thyristors combined with
extremely high dI/dt capability. This semiconductor is intended for
the control of high power circuits with the use of very small
amounts of input energy and is ideally suited for capacitor
discharge applications.

The cathode and gate contact pads are metallized with aluminum
for al min m ire bondable s rfaces

The Anode is metali ed

Cathode Bond Area

Solidtron

TM

N-MOS VCS, Bare Die

Data Sheet (Rev 0 - 10/28/10)

SMCTAC65N16

275 Great Valley Parkway
Malvern, PA 19355
Ph: 610-407-4700

Schematic Symbol

Gate Bond

Area

Gate Return

Bond Area

The voltage controlled Solidtron

TM

(VCS) discharge switch is an n-

type MOS-Controlled Thyristor semiconductor.

The VCS features the high peak current capability and low On-
state voltage drop common to SCR thyristors combined with
extremely high dI/dt capability. This semiconductor is intended for
the control of high power circuits with the use of very small
amounts of input energy and is ideally suited for capacitor
discharge applications.

The cathode and gate contact pads are metallized with aluminum
for aluminum wire bondable surfaces. The Anode is metalized
with solderable metal providing the user with a solderable die
attach device that may be installed using conventional or lead free
solders.

Anode (A)

Bare Die

Cathode Bond Area

Anode

Bond Area

Solidtron

TM

N-MOS VCS, Bare Die

Data Sheet (Rev 0 - 10/28/10)

SMCTAC65N16

275 Great Valley Parkway
Malvern, PA 19355
Ph: 610-407-4700

Features

Gate Bond

Area

Gate Return

Bond Area

The voltage controlled Solidtron

TM

(VCS) discharge switch is an n-

type MOS-Controlled Thyristor semiconductor.

The VCS features the high peak current capability and low On-
state voltage drop common to SCR thyristors combined with
extremely high dI/dt capability. This semiconductor is intended for
the control of high power circuits with the use of very small
amounts of input energy and is ideally suited for capacitor
discharge applications.

The cathode and gate contact pads are metallized with aluminum
for aluminum wire bondable surfaces. The Anode is metalized
with solderable metal providing the user with a solderable die
attach device that may be installed using conventional or lead free
solders.



1400V Peak Off-State Voltage



<150nSec Turn-On Delay



Low On-State Voltage



MOS Gated Control

Anode (A)

Gate (G)

Cathode (K)

Gate Return (GR)

Bare Die

Cathode Bond Area

Anode

Bond Area

Solidtron

TM

N-MOS VCS, Bare Die

Data Sheet (Rev 0 - 10/28/10)

SMCTAC65N16

275 Great Valley Parkway
Malvern, PA 19355
Ph: 610-407-4700

Absolute Maximum Ratings

SYMBOL

VALUE

UNITS

Peak Off-State Voltage

V

DRM

1400

V

Peak Reverse Voltage

V

RRM

-5

V

Off-State Rate of Change of Voltage Immunity

dv/dt

5000

V/uSec

Gate Bond

Area

Gate Return

Bond Area

The voltage controlled Solidtron

TM

(VCS) discharge switch is an n-

type MOS-Controlled Thyristor semiconductor.

The VCS features the high peak current capability and low On-
state voltage drop common to SCR thyristors combined with
extremely high dI/dt capability. This semiconductor is intended for
the control of high power circuits with the use of very small
amounts of input energy and is ideally suited for capacitor
discharge applications.

The cathode and gate contact pads are metallized with aluminum
for aluminum wire bondable surfaces. The Anode is metalized
with solderable metal providing the user with a solderable die
attach device that may be installed using conventional or lead free
solders.



1400V Peak Off-State Voltage



<150nSec Turn-On Delay



Low On-State Voltage



MOS Gated Control

Anode (A)

Gate (G)

Cathode (K)

Gate Return (GR)

Bare Die

Cathode Bond Area

Anode

Bond Area

Solidtron

TM

N-MOS VCS, Bare Die

Data Sheet (Rev 0 - 10/28/10)

SMCTAC65N16

275 Great Valley Parkway
Malvern, PA 19355
Ph: 610-407-4700

Continuous Anode Current at 110

o

C

I

A110

65

A

Repetitive Peak Anode Current (Pulse Width=1uSec)

I

ASM

6000

A

Rate of Change of Current

dI/dt

125

kA/uSec

Continuous Gate-Cathode Voltage

V

GKS

+/-20

V

Peak Gate-Cathode Voltage

V

GKM

+/-25

V

Minimum Negative Gate-Cathode Voltage Required for Garanteed Off-State

V

GK(OFF-MIN)

-5

V

M i

J

ti

T

t

T

150

o

C

Maximum Junction Temperature

T

JM

150

o

C

Maximum Soldering Temperature (Installation)

350

o

C

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