Pin description, Ddr3 udimm w/o ecc product specification – SP / Silicon Power SP008GBLTU160N02 User Manual

Page 5

Advertising
background image

DDR3 UDIMM w/o ECC

Product Specification

Rev. 1.5 May. 2012

5

Pin Description

Symbol

Type

Description

A0–A14 Input

Address inputs:

Provide the row address for ACTIVE commands and the column address

and auto precharge bit for READ/WRITE commands to select one location out of the

memory array in the respective bank. A10 is sampled during a PRECHARGE command to

determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10

HIGH). If only one bank is to be precharged, the bank is selected by BA. A12 is sampled

during READ and WRITE commands to determine if burst chop (on-the-fly) will be

performed. The address inputs also provide the opcode during mode register command set.

A0–A13 (128Mx8) A0–A14 (256Mx8).

BA0–BA2 Input

Bank address inputs:

BA0, BA1 define to which device bank an ACTIVE, READ, WRITE,

orPRECHARGE command is being applied. BA0, BA1 define which mode register,

including MR, EMR, EMR(2), and EMR(3), is loaded during the LOAD MODE command.

CK0, CK0#,

CK1, CK1#

Input

Clock:

CK and CK# are differential clock inputs. All address and control input signals are

sampled on the crossing of the positive edge of CK and negative edge of CK#. Output data

(DQs and DQS/DQS#) is referenced to the crossings of CK and CK#.

CKE0, CKE1

Input

Clock enable:

CKE (registered HIGH) activates and CKE (registered LOW) deactivates

clocking circuitry on the DDR3 SDRAM.

DM0–DM7 Input

Data input mask:

DM is an input mask signal for write data. Input data is masked when DM

issampled HIGH, along with that input data, during a write access. DM is sampled on both

edges of DQS. Although DM pins are input-only, the DM loading is designed to match that

of DQ and DQS7pins.

ODT0

ODT1

Input

On-die termination:

ODT (registered HIGH) enables termination resistance internal to the

DDR3 SDRAM. When enabled, ODT is only applied to the following pins: DQ, DQS, DQS#

and DM. The ODT input will be ignored if disabled via the LOAD MODE command.

RAS#, CAS#,

WE#

Input

Command inputs:

RAS#, CAS#, and WE# (along with S#) define the command being

entered.

RESET#

Input

(LVCMOS)

Reset:

RESET# is an active LOW CMOS input referenced to V

SS

. The RESET# input

receiver is a CMOS input defined as a rail-to-rail signal with DC HIGH ≥ 0.8 ×V

DD

and DC

LOW ≤ 0.2 ×V

DD

.

S0#, S1#

Input

Chip select:

S# enables (registered LOW) and disables (registered HIGH) the command

decoder.

SA[2:0] Input

Presence-detect address inputs:

These pins are used to configure the SPD EEPROM

address range.

SCL Input

Serial clock for presence-detect:

SCL is used to synchronize the presence-detect data

transfer to and from the module.

DQ0–DQ63 I/O

Data input/output:

Bidirectional data bus.

DQS0–DQS7

DQS0#–DQS7#

I/O

Data strobe:

Output with read data, input with write data for source synchronous operation.

Edge-aligned with read data, center-aligned with write data.

SDA I/O

Serial presence-detect data:

SDA is a bidirectional pin used to transfer addresses and

data into and out of the SPD EEPROM on the module.

V

DD

Supply

Power supply:

1.5V ±0.075V. The component V

DD

and V

DDQ

are connected to the module

V

DD

.

V

DDSPD

Supply

Temperature sensor/SPD EEPROM power supply:

+3.0V to +3.6V.

V

REFCA

Supply

Reference voltage:

Control, command, and address (V

DD

/2).

V

REFDQ

Supply

Reference voltage:

DQ, DM (V

DD

/2).

V

SS

Supply

Ground.

V

TT

Supply

Termination voltage:

Used for control, command, and address (V

DD

/2).

NC –

No connect:

These pins are not connected on the module.

NU –

Not used:

These pins are not used in specific module configuration/operations.

Advertising