Teledyne LeCroy PETracer Gen3 Mid-Bus Probe Dish Interface Quick Start - Manual

Introduction
The Teledyne LeCroy PCIe 3.0 x8 Dish mid-Bus Probe interface platform allows developers
to attach a protocol analyzer to probe PCI Express buses during the prototype stage of board
development. The dish board has 62 pairs of high-speed SMP connectors for signal
attachment and a PCIe 3.0 mid-bus probe footprint in the center of the board.
The dish board can be mechanically fixed to the DUT using any of the six mounting holes for
standoffs, four around the rim and two inner along a diameter. Standoff size can vary to
accommodate component heights on the DUT board.
Connections from the dish SMP connectors to test points on the DUT use standard coaxial
cables. You can use multiple boards and backplanes. For example, you can connect an
analyzer in a chip-to-chip serial interconnect test environment, an add-in card via a standard
PCIe slot, or a cable or backplane assembly to test signal transmission in real application
environments.
Features are:
• Probing of PCIe
®
buses during prototype and early development of PCIe 2.0 and 3.0
designs
• Stable mounting platform for a mid-bus probe
• Reliable connections to PCIe buses across multiple test boards
• Optimized signal integrity across all lanes using Rogers 4350 low-loss
dielectric for outer layers and Isola 370HR for inner layers with no solder mask.
• x1, x2, x4 and x8 Lane Widths on one dish, and x16 with two dishes
• PCIe 3.0 data rates: 2.5 GT/s, 5GT/s, and 8 GT/s
Circuit Board Layering
Layer Number Type Function
1 Signal Data Signals
2 Plane Ground
3 Plane No Routing
4 Plane No Routing
5 Plane Ground
6 Signal Data Signals
PETracer™
Gen3 Mid-Bus Probe
Dish Interface
Quick Start
Before Starting
Use this document for quick installation and
setup.
1