Soldering conditions, Tact switch – Alps Electric SKPL Series User Manual

Page 3

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Snap-in
Type

Surface
Mount Type

Radial
Type

TACT Switch

TM

Sharp
Feeling

Soft
Feeling

374

Detector

Push

Slide

Rotary

Encoders

Power

Dual-in-line
Package Type

Multi Control
Devices

Custom-
Products

TACT Switch

TM

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

CA K or CC T at solder joints copper foil surface . A heat resistive tape

should be used to fix thermocouple.

3. Temperature profile

Soldering Conditions

Condition for Reflow

Available for Surface Mount Type.

180

150

260˚C max. 3 sec max.

230˚C

Time

3 to 4min.

Time inside soldering equipment

Temperature (˚C )

40s max.

Manual Soldering

Except SKRT series

Flux built-up

Mounting surface

should not be exposed to flax

Ambient temperature of the soldered

surface of PC board.

100

max.

60s max.

260

max.

5s max.

Preheating temperature

Preheating time

Soldering temperature

Duration of immersion

Items

Condition

Condition

2times max.

Number of soldering

Soldering temperature

350

max.

3s max.

Duration of soldering

60W max.

Capacity of soldering iron

Items

1. Consult with us for TACT Switch

TM

washing conditions.

2. Prevent flux penetration from the top side of the TACT Switch

TM

.

3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.
5. Use the flux with a specific gravity of min 0.81.

EC-19S-8 by TAMURA Corporation, or equivalents.

Notes

Conditions for Auto-dip

Available for Snap-in Type and Radial Type

Except SKHJ, SKHL, SKQJ, SKQK, SKEG series

1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC

board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Note

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