Silicon Motion FC7860 - Manual

FC7860
Highly Integrated RFIC for Multi-band & Multi-mode
for Quad-Band GSM/GPRS/EDGE and HSPA/HSPA+/LTE
FCI Confidential and Proprietary Information 1 / 19 Last Update Feb/03/2012
These materials could be changed without prior notice.
Future
Communications
Integrated circuit Inc.
D
ESCRIPTION
FC7860 is a highly integrated RFIC that covers
multi-band and multi-mode HSPA/HSPA+/LTE along
with quad-band GSM/GPRS/EDGE. FC7860 is
MCP (multi-chip package) which includes
LTE/HSPA+/HSPA and GSM/EDGE with 7mm x
7mm small leadless BGA package. The companion
baseband modem chip is CMC221 which enables
several digital standards such as 2G/2.5G
(GSM/GPRS/EDGE), 3G (HSPA), and 3.9G
(HSPA+/LTE). FC7860 covers all the required
frequency bands that 2G/2.5G/3G/3.9G requires.
The HSPA/HSPA+/LTE chip fully supports 2x1 (2RX
1TX) receiver diversity for the increased data traffic.
HSPA/HSPA+/LTE die is a highly integrated chip
working with dual supply voltage such as 1.2V and
1.8V. The 4-wired serial-to-parallel interface (SPI)
enables operating in various modes.
HSPA/HSPA+/LTE die contains complete multi-
band receiver diversity path such as LNA, down-
conversion mixer, channel selection filter (CSF),
baseband programmable gain amplifier (PGA), Rx
VCO, Rx PLL, and LO distribution block. FC7850
also contains complete transmitter path such as
baseband amplifier, up-converter, RF
programmable gain amplifier (PGA), programmable
drive amplifier, Tx VCO, Tx PLL, and LO distribution
block.
GSM/GPRS/EDGE transceiver is a complete RF
front end for GSM/GPRS/EDGE wireless
communication. It has an integrated power
manager unit which can be directly connected to
battery power supply. The receive section interfaces
between the RF band-select SAW filter and
baseband IC. The GSM/GPRS/EDGE receiver
employs a digital low-IF/Zero IF architecture, and
support both universal analog baseband interfaces
and DigRF 1.12 digital interface. In GSM GMSK
modulation mode, the transmit section provides a
direct modulation PLL transmitter from the
baseband subsystem to the power amplifier (PA). In
8PSK mode, traditional direct modulation
architecture to translate BB 8PSK signal to RF. A
fast settling fractional-N synthesizer is fully
integrated including RF VCO, loop filters, and
varactors, and etc.
F
EATURES
 HSPA/HSPA+/LTE transceiver chip supports
2RX and 1TX (2x1) MIMO receiver diversity
transceiver covering multi-band (Band1~40)
from 680MHz to 2700MHz.
 HSPA/HSPA+/LTE transceiver chip capable of
FDD-LTE and TDD-LTE.
 HSPA/HSPA+/LTE transceiver chip requires
modem assisted TX LO leakage, TX I/Q and
RX DC offset calibration along with self-
calibrated VCO and RX and TX filter cut-off
frequency calibration.
 GSM/GPRS/EDGE transceiver covers GSM
850, E-GSM 900, DCS1800, and PCS1900
with low-IF/Zero IF receiver and direct
modulation transmitter architecture.
 GSM/GPRS/EDGE transceiver supports
universal analog baseband interface and also
DigRF V1.12 digital interface
 GSM/GPRS/EDGE transceiver integrates
LDO (3.3 to 4.2V) allowing reception of
battery voltage
 7x7mm small leadless BGA package
A
PPLICATIONS
- Multi-band GSM/EDGE/LTE/HSPA+ mobile
phone
- Multi-band GSM/EDGE/LTE/HSPA+ wireless
data modems
R
EVISION
H
ISTORY
- Tentative version: August, 12, 2011.
- Preliminary version: Feb, 03, 2012.