Table 5, Chapter 7 – AMD Athlon 27493 User Manual

Page 37

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Chapter 7

Advanced 400 Front-Side Bus AMD Athlon™ XP Processor Model 10 Specifications

25

26237C—May 2003

AMD Athlon™ XP Processor Model 10 Data Sheet

Preliminary Information

7

Advanced 400 Front-Side Bus AMD Athlon™ XP
Processor Model 10 Specifications

This chapter describes the electrical specifications that are
u n i q u e t o t h e a d v a n c e d 4 0 0 f r o n t - s i d e b u s ( F S B )
AMD Athlon™ XP processor model 10.

7.1

Electrical and Thermal Specifications for the Advanced 400 FSB
AMD Athlon™ XP Processor Model 10

Table 5 shows the electrical and thermal specifications in the
C0 working state and the S1 Stop Grant state for this processor.

Table 5.

Electrical and Thermal Specifications for the Advanced 400 FSB AMD Athlon™ XP Processor
Model 10

Frequency in MHz

(Model Number)

V

CC_CORE

(Core

Voltage)

I

CC

(Processor Current)

Thermal Power

5

Maximum Die

Temperature

Working State C0

Stop Grant S1

1, 2, 3, 4

Maximum Typical

Maximum

Typical Maximum Typical

2100 (3000+)

1.65 V

41.4 A

32.5 A

12.1 A

7.2 A

68.3 W

53.7 W

85°C

2200 (3200+)

46.5 A

36.6 A

76.8 W

60.4 W

Notes:

1. See Figure 3, "AMD Athlon™ XP Processor Model 10 Power Management States" on page 9.

2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the

process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified

current.

3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant

disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of

2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and

AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.

4. The Stop Grant current consumption is characterized at 50°C and not tested.

5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or

instruction sequences under normal system operation at nominal V

CC_CORE

. Thermal solutions must monitor the temperature of

the processor to prevent the processor from exceeding its maximum die temperature.

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