Agilent Technologies HFBR 5203 - Manual (Page 9)

9
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
These products are suitable for
use in designs ranging from a
desktop computer with a single
transceiver to a concentrator or
switch product with large number
of transceivers.
In all well-designed chassis, the
two 0.5" holes required for ST
connectors to protrude through,
will provide 4.6 dB more
shielding than one 1.2" duplex SC
rectangular cutout. Thus, in a
well-designed chassis, the duplex
ST 1x9 transceiver emissions will
be identical to the duplex SC 1x9
transceiver emissions.
Immunity
Equipment utilizing these trans-
ceivers will be subject to radio-
frequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields.
For additional information regard-
ing EMI, susceptibility, ESD and
conducted noise testing proce-
dures and results on the 1x9
transceiver family, please refer to
Applications Note 1075, Testing
and Measuring Electro-
magnetic Compatibility
Performance of the HFBR-
510X/-520X Fiber Optic
Transceivers.
25.4
42.0
24.8
9.53
(NOTE 1)
39.12
6.79
25.4
12.09
11.1
0.75
12.0
0.51
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9
Connectored Transceivers.