Change settings while printing, Advanced settings, Substrate settings – HP Latex 210 Printer User Manual
Page 68
Change settings while printing
You can use the front panel to change the following settings while printing.
●
To change temperature and vacuum settings while printing: select the icon, then Image
quality maintenance > Adjust printing params, and choose the setting that you want to
adjust. You can use the arrow keys to adjust the curing temperature, the drying temperature or the
vacuum pressure. The changes that you make take effect immediately, but they are not saved: the
next job will use the settings in the media profile as usual.
●
To change substrate advance calibration while printing (in case of banding): select the icon,
then Image quality maintenance > Substrate advance calib > Adjust substrate
advance. You can use the arrow keys to adjust the substrate advance. The changes that you
make take effect immediately, but they are not saved for the next job. See also the Maintenance
and troubleshooting guide.
●
To enable or disable extra printhead cleaning while printing: select the icon, then Image
quality maintenance > Enable extra PH cleaning or Disable extra PH cleaning. In
this case, the change of setting is saved for subsequent jobs.
NOTE:
Extra printhead cleaning shortens the life of the printhead cleaning cartridge.
Advanced settings
Here are some more advanced settings, which you are not recommended to change, unless you have
problems that you cannot resolve any other way.
The drying and curing temperatures used by the printer are determined by adding the offset to the base
temperature. The base temperatures shown in the table are the default values for each substrate family,
but may be changed by the printer depending on the printer settings in use. You cannot change the
base temperatures yourself, but you can change the offsets. The base warm-up drying temperature is
determined by the RIP.
Your RIP may have an option to return all settings to their default values.
Substrate
family
Warm-up
drying
temperat
ure offset
Warm-up
curing
temperat
ure
Warm-up
curing
temperat
ure offset
Cool-
down
drying
temperat
ure
Cool-
down
drying
temperat
ure offset
Cool-
down
curing
temperat
ure
Cool-
down
curing
temperat
ure offset
Minimum
drying
power
Self-
adhesive
10
95
0
80
0
95
0
0.7
Banner
10
95
0
80
0
90
0
0.7
Textile
5
85
0
80
0
90
0
0.7
Film
5
85
0
80
0
100
0
0.7
Synthetic
paper
5
80
0
75
0
85
0
0
Paper-
aqueous
5
60
0
75
0
85
0
0
Paper-
solvent
10
75
0
75
0
90
0
0.7
64
Chapter 5 Substrate settings
ENWW
Substrate settings