Alps Electric SSCM Series - Manual (Page 3)

Power
70
Detector
Push
Slide
Rotary
Encoders
Dual-in-line
Package Type
Multi Control
Devices
TACT Switch TM
Custom-
Products
Detector Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T at soldering portion copper foil surface . A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Notes
Series Reflow type
SPPB
260
230
200
230
40
20
40
180 150 120
SPVN
SPPW8
SPVP
SPVE
SPVG
SPVL
250
SPVM
SPVS
SSCM
SPPY5 240 20 150
Room
Temperature
180
SPVR
A
3s max.
B C s D E F s