AMD OPTERON 30925 - Manual (Page 37)

30925 Rev. 3.04 February 2004 Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
Chapter 5 Hardware Considerations 37
Table 3. AMD Opteron™ Processor Series and Model Numbers (Continued)
Series 100 Series 200 Series 800 Series
L1/L2 data cache
protection ECC ECC ECC
L1/L2 instruction cache
protection Parity Parity Parity
Global history counter
entries 16K 16K 16K
L1 TLB entries
(data/instruction) 40/40 40/40 40/40
L1 associativity
(data/instruction) Full/Full Full/Full Full/Full
L2 TLB entries
(data/instruction) 512/512 512/512 512/512
L2 associativity
(data/instruction) 4-way/4-way 4-way/4-way 4-way/4-way
Process .13 micron SOI .13 micron SOI .13 micron SOI
Manufactured In Fab 30, Dresden
Germany Fab 30, Dresden
Germany Fab 30, Dresden
Germany
5.6 AMD Chipset Information
AMD offers an array of chipset products designed to unleash the full power of AMD Opteron,
processors. From workstations to multiprocessor servers, AMD provides a world-class high-
performance chipset solution to enable the most demanding designs.
5.6.1 AMD-8000™ Series Chipset
Ushering in the next generation of computing platforms, AMD introduces the AMD-8000™ series
of core-logic components designed to support the AMD Opteron processor. Implementing
HyperTransport technology as the system backbone, these core-logic elements deliver outstanding
performance and design flexibility. This chipset consists of several “building block” components
that can be used together in a variety of system designs.
5.6.1.1 AMD-8151™ HyperTransport™ AGP3.0 Graphics Tunnel
The AMD-8151™ HyperTransport™ AGP3.0 graphics tunnel provides AGP3.0 capability to
workstation platforms requiring high-end graphics performance. Included in the AMD-8151
graphics tunnel are the following high-level features: