Cirrus Logic CS4340A - Manual (Page 20)

CS4340A
20 DS590F2
7. PACKAGE DIMENSIONS
THERMAL CHARACTERISTICS AND SPECIFICATIONS
INCHES MILLIMETERS
DIM MIN NOM MAX MIN NOM MAX
A 0.053 0.064 0.069 1.35 1.63 1.75
A1 0.004 0.006 0.010 0.10 0.15 0.25
b 0.013 0.016 0.020 0.33 0.41 0.51
C 0.0075 0.008 0.010 0.19 0.20 0.25
D 0.386 0.390 0.394 9.80 9.91 10.00
E 0.150 0.154 0.157 3.80 3.90 4.00
e 0.040 0.050 0.060 1.02 1.27 1.52
H 0.228 0.236 0.244 5.80 6.0 6.20
L 0.016 0.025 0.050 0.40 0.64 1.27
∝
0° 4° 8° 0° 4° 8°
JEDEC #: MS-012
Controling Dimension is Millimeters
Parameters Symbol Min Typ Max Units
Package Thermal Resistance (multi-layer boards)
θ
JA
- 74 - °C/Watt
e
16L SOIC (150 MIL BODY) PACKAGE DRAWING
D
H E
b
A1
A
c
L
∝ SEATING
PLANE
1