HMC Electronics 10-3702 GC Electronics 10-3702 Q-Dope User Manual

Rohs and lead free certificate of compliance, Q dope, 2 oz. bottle

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PART NUMBER

10-3702

DESCRIPTION

Q DOPE, 2 OZ. BOTTLE

LEAD FREE Y

ROHS Y

This document certifies that the above stated GC Electronics product is compliant with the Directive 2002/95/EC of the European Parliament
on the Restriction of Hazardous Substances in electrical and electronics equipment (RoHS Directives)
. The stated product is deemed to be
concentration values issued by the European Union Technical Adaptation Committee (TAC) as shown below.

Maximum

Actual

Maximum

Actual

Substance

Allowed

Concentration

Substance

Allowed

Concentration

LEAD - Pb 0.1%

<0.1%

Hexavalent Chromium - Cr (VI)

0.1%

<0.1%

Mercury - Hg 0.1%

<0.1%

Polybrominated - PBB

0.1%

<0.1%

Cadmium - Cd 0.01%

<0.01%

Polybrominated diphenyl ethers - PBDB

0.1%

<0.1%

RoHS and Lead Free

Certificate of Compliance

RoHS exemptions.


Applications of lead, mercury, cadmium and hexavalent chromium, which are exempted from the
requirements of Article 4(1) of the RoHS Directive.

1

Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.


2

Mercury in straight fluorescent lamps for general purposes not exceeding:
— halophosphate 10 mg
— triphosphate with normal lifetime 5 mg
— triphosphate with long lifetime 8 mg


3

Mercury in straight fluorescent lamps for special purposes


4

Mercury in other lamps not specifically mentioned in this Annex


5

Lead in glass of cathode ray tubes, electronic components and fluorescent tubes


6

Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by
weight and as a copper alloy containing up to 4 % lead by weight


7

— lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,
signalling, transmission as well as network management for telecommunications
— lead in electronic ceramic parts (e.g. piezoelectronic devices)


8

Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive
91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous
substances and preparations


9

Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators


9a

DecaBDE in polymeric applications


9b

Lead in lead-bronze bearing shells and bushes


10

Lead used in compliant pin connector systems


11

Lead as a coating material for the thermal conduction module c-ring


12

Lead and cadmium in optical and filter glass


13

Lead in solders consisting of more than two elements for the connection between the pins and the package of
microprocessors with a lead content of more than 80% and less than 85% by weight


14

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit
Flip Chip packages.

Signed: ___________________________
Eric Smith - Product Manager GC Electronics

Compliant Date:

Control No:

12980

Record No:

31

Always Compliant: Y

GC Electronics - 1801 Morgan Street - Rockford, IL 61102 - Phone 815-316-9080 - Fax 815-316-9081 - Website www.gcelectronics.com

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

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