HMC Electronics 41045 Loctite 410 Prism Instant Adhesive, Toughened, (Black) Gap Filling - Manual

Technical Data Sheet
LOCTITE
®
410™
March - 2008
PRODUCT DESCRIPTION
LOCTITE
®
410™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Black liquid LMS
Components One part - requires no mixing
Viscosity High
Cure Humidity
Application Bonding
Key Substrates Metals, Plastics and Rubbers
LOCTITE
®
410™ is a rubber toughened adhesive with
increased flexibility and peel strength along with enhanced
resistance to shock.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1
Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):
Spindle 3, speed 20 rpm 1,700 to 5,000 LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased) 60 to 120
Aluminum 10 to 30
Neoprene 15 to 25
Rubber, nitrile 15 to 25
ABS 20 to 50
PVC 50 to 100
Polycarbonate 30 to 90
Phenolic 20 to 60
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K -1
80×10 -6
Coefficient of Thermal Conductivity, ISO 8302
,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228,
°C
120
Electrical Properties:
Dielectric Constant / Dissipation Factor, IEC 60250:
0.05 - kHz 2.3 / <0.02
1 - kHz 2.3 / <0.02
1,000 - kHz 2.3 / <0.02
Volume Resistivity, IEC 60093, Ω·cm 10×10 15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 22
(psi) (3,190)
Aluminum (etched) N/mm² 15
(psi) (2,175)
ABS N/mm² >6
(psi) (>870)
PVC N/mm² >6
(psi) (>870)
Polycarbonate N/mm² >5
(psi) (>725)
Phenolic N/mm² 10
(psi) (1,450)
Neoprene N/mm² >10
(psi) (>1,450)
Nitrile N/mm² >10
(psi) (>1,450)
Tensile Strength, ISO 6922:
Steel (grit blasted) N/mm² 18.5
(psi) (2,680)
After 48 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥15.8
(psi) (≥2,290)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440