HMC Electronics 41145 Loctite 411 Prism Instant Adhesive, Toughened, (Clear) Gap Filling User Manual
Loctite
Technical Data Sheet
LOCTITE
®
411™
September
-
2009
PRODUCT DESCRIPTION
LOCTITE
®
411™
provides
the
following
product
characteristics:
Technology
Cyanoacrylate
Chemical Type
Ethyl cyanoacrylate
Appearance (uncured)
Water white to slightly cloudy gel
LMS
Components
One part - requires no mixing
Viscosity
High
Cure
Humidity
Application
Bonding
Key Substrates
Rubbers, Plastics and Metals
LOCTITE
®
411™ is a general purpose gap filling adhesive
suitable for bonding rubber, plastic and metals. LOCTITE
®
411™ exhibits excellent peel strength and added heat
resistance.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C
1.05
Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):
Spindle TC, speed 20 rpm, Helipath
4,000 to 8,000
LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased)
20 to 50
Aluminum
10 to 30
Neoprene
<5
Rubber, nitrile
<5
ABS
15 to 40
PVC
20 to 50
Polycarbonate
30 to 70
Phenolic
10 to 40
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1
80×10
-6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228, °C 120
Electrical Properties:
Dielectric Constant / Dissipation Factor, IEC 60250:
0.05
-
kHz
2.3 / <0.02
1
-
kHz
2.3 / <0.02
1,000
-
kHz
2.3 / <0.02
Volume Resistivity, IEC 60093, Ω·cm
10×10
15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 30 seconds @ 22 °C
Tensile Strength, ISO 6922:
Buna-N
N/mm² ≥7.0
LMS
(psi) (≥1,015)
Cured for 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted)
N/mm² 18 to 26
(psi) (2,610 to 3,770)
Aluminum (etched)
N/mm² 11 to 19
(psi) (1,595 to 2,755)
ABS
N/mm² >6
(psi) (>870)
PVC
N/mm² >6
(psi) (>870)
Polycarbonate
N/mm² >5
(psi) (>725)
Phenolic
N/mm² 5 to 15
(psi) (725 to 2,175)
Neoprene
N/mm² >10
(psi) (>1,450)
Nitrile
N/mm² >10
(psi) (>1,450)
Tensile Strength, ISO 6922:
Steel (grit blasted)
N/mm² 12 to 25
(psi) (1,740 to 3,625)
Cured for 24 hours @ 22 °C, followed by 24 hours @ 121 °C, tested
@ 121 °C
Lap Shear Strength, ISO 4587:
Steel (grit
blasted) N/mm² ≥8.3
LMS
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440