HMC Electronics 40904 Loctite 409 SuperBonder, Instant Adhesive, General Purpose Gel - Manual

Technical Data Sheet
LOCTITE
®
409
December - 2008
PRODUCT DESCRIPTION
LOCTITE
®
409 provides the following product characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Clear to slightly cloudy gel LMS
Components One part - requires no mixing
Viscosity High
Cure Humidity
Application Bonding
Key Substrates Plastics, Rubbers and Metals
LOCTITE
®
409 is a general purpose cyanoacrylate adhesive
gel. The gel consistency prevents adhesive flow even on
vertical surfaces.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.05
Flash Point - See MSDS
Casson Viscosity, 25 °C, mPa·s (cP):
Cone and plate rheometer ≥4,000 LMS
Viscosity, Brookfield - RVF, 25 °C, mPa·s (cP):
Spindle TC, speed 20 rpm, Helipath *15,000 to 40,000 LMS
* Applies to material made in N. America
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased) 50 to 100
Aluminum 5 to 30
Neoprene 15 to 25
Rubber, nitrile 15 to 25
ABS 20 to 60
PVC 50 to 100
Polycarbonate 40 to 80
Phenolic 20 to 50
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K -1
80×10 -6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228, °C 120
Electrical Properties:
Dielectric Constant / Dissipation Factor, IEC 60250:
0.05 - kHz 2.3 / <0.02
1 - kHz 2.3 / <0.02
10 - kHz 2.3 / <0.02
Volume Resistivity, IEC 60093, Ω·cm 10×10 15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 18 to 26
(psi) (2,610 to 3,770)
Aluminum (etched) N/mm² 11 to 19
(psi) (1,595 to 2,755)
ABS N/mm² >6
(psi) (>870)
PVC N/mm² >6
(psi) (>870)
Polycarbonate N/mm² >5
(psi) (>725)
Phenolic N/mm² 5 to 15
(psi) (725 to 2,175)
Neoprene N/mm² >10
(psi) (>1,450)
Nitrile N/mm² >10
(psi) (>1,450)
Tensile Strength, ISO 6922:
Steel (grit blasted) N/mm² 12 to 25
(psi) (1,740 to 3,625)
After 30 seconds @ 22 °C
Tensile Strength, ISO 6922:
Buna-N N/mm² ≥7.0 LMS
(psi) (≥1,015)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440