HMC Electronics 29294 Loctite E-00NS Hysol 2-Part Epoxy Adhesive, Non-Sag, Fast Setting - Manual

Technical Data Sheet
Hysol
®
E-00NS™
December - 2006
PRODUCT DESCRIPTION
Hysol
®
E-00NS™ provides the following product
characteristics:
Technology Epoxy
Chemical Type (Resin) Epoxy
Chemical Type
(Hardener)
Mercaptan
Appearance (Resin) Translucent white to yellow paste LMS
Appearance (Hardener) Clear colorless to slightly yellow
liquid LMS
Appearance (Mixed) translucent to yellow solid LMS
Components Two component - requires mixing
Viscosity Low
Mix Ratio, by volume -
Resin : Hardener
1 : 1
Mix Ratio, by weight -
Resin : Hardener
100 : 92
Cure Room temperature cure after mixing
Application Bonding
Hysol ® E-00NS™ is a fast setting, non-sagging,
thixotropic, industrial grade epoxy adhesive. Once mixed, the
two component epoxy cures at room temperature to form a
translucent, rigid, machineable bondline. When fully cured, the
epoxy is resistant to a wide range of chemicals and solvents,
and acts as an excellent electrical insulator. Typical
applications include bonding plastic, metal, glass, wood,
ceramic, rubber, and masonry materials. Its non-sagging
formula is especially suited for use on vertical surfaces to avoid
run-off, as well as staking fillet bonds and general industrial
repairs. Designed for use in component assembly, appliances,
electronics, & fiber optics.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Resin:
Specific Gravity @ 25 °C 1.1 to 1.3 LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP)
200,000 to 700,000 LMS
Hardener:
Specific Gravity @ 25 °C 1.0 to 1.2 LMS
Flash Point - See MSDS
Viscosity @ 25°C, mPa·s (cP)
20,000 to 70,000 LMS
Mixed:
Specific Gravity @ 25 °C 1.15
Working life, minutes 3
Tack Free Time minutes 3.5
2 Grams, 60° Angle ≤2.54 LMS
TYPICAL CURING PERFORMANCE
Cure Speed vs. Time
The graph below shows shear strength developed with time on
abraded, acid etched aluminum lapshears @ 25 °C with an
average bondline gap of 0.1 to 0.2 mm and tested according to
ISO 4587.
% of Full Strength on Alumin.
Cure Time
100
75
50
25
0
1min 5min 10min 30min 1h 3h 6h 24h 72h
Gel Time
Gel time, 25 °C, minutes 2 to 6 LMS
TYPICAL PROPERTIES OF CURED MATERIAL
Cured @ 25 °C
Physical Properties:
Glass Transition Temperature (Tg), °C 20
Shore Hardness, ISO 868, Durometer D 80
Elongation, ISO 527-2, % 15
Tensile Strength, ISO 527-2 N/mm² 10
(psi) (1,500)
Electrical Properties:
Dielectric Breakdown Strength, IEC 60243-1, kV/mm 16
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 5 days @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 11
(psi) (1,600)
Aluminum (acid etched & abraded),
0.1 to 0.2 mm gap
N/mm² 17
(psi) (2,500)
Aluminum (anodised) N/mm² 8
(psi) (1,200)
Stainless steel N/mm² 4.3
(psi) (620)
Polycarbonate N/mm² 3.2
(psi) (460)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440