HMC Electronics R276 Kester Lead-Free Paste User Manual
R276, Product description, Standard application
R276
R276
Dispensable No-Clean Solderpaste
Dispensable No-Clean Solderpaste
for Lead-free Alloys
for Lead-free Alloys
Product Description
Kester R276 is a lead-free, no-clean solder paste
specifically designed for optimal characteristics in
all types of dispensing applications. R276 is
packaged void-free to insure consistent dispensing
in high speed automated processes. The flow
characteristics of R276 provide for excellent
dispensing characteristics with a wide range of
needle diameters.
• Excellent dispensing characteristics using 22
gage needles and Type 3 powder
• Manufactured and packaged void-free to insure
the most consistent dispensibility available
• Capable of several thousands of dots per hour
in high speed automated dispense equipment
• High activity on all substrates, including OSPs
• Stable tack over 8+ hours
• Available with leaded alloys
• Compatible with Kester Easy Profile
®
256
stenciling solderpaste
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
Standard Application
86% Metal -- Dispensing
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.
Physical Properties
(Data given for Sn96.5Ag3.0Cu0.5 86% metal, -325+500 mesh)
Viscosity (typical): 650 poise
Malcom Viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 30 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Preferred
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.3
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
R276
Day 1
1.0
×10
10
Ω
9.8
× 10
8
Ω
Day 4
1.3
×10
10
Ω
1.6
× 10
9
Ω
Day 7
1.3
×10
10
Ω
1.1
× 10
9
Ω
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440