HMC Electronics EP256 Kester Solder Paste - Manual (Page 2)

Application Notes
Availability:
Easy Profile ® 256HA is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder
mesh is recommended, but different powder particle size distributions are available for standard and fine
pitch applications. For specific packaging information, see Kester's Solder Paste Chart for available sizes.
The appropriate combination depends on process variables and the specific application.
Printing Parameters:
Squeegee Blade 80 to 90 durometer polyurethane or stainless steel
Squeegee Speed Capable to a maximum speed of 200 mm/sec (8 in/sec)
Stencil Material Stainless Steel, Molybdenum, Nickel Plated, Brass
Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% R.H.
Recommended Reflow Profile:
The recommended reflow profile for EP256HA made
with either the Sn63Pb37 or Sn62Pb36Ag02 is shown
here. This profile is simply a guideline. Since
EP256HA is a highly active solder paste, it can solder
effectively over a wide range of profiles. Your optimal
profile may be different from the one shown based on
your oven, board and mix of defects. Please contact
Kester if you need additional profiling advice.
Cleaning:
EP256HA is a no-clean formula. The residues don't need to be removed for typical applications. Although
EP256HA is designed for no-clean applications, its residues can be easily removed using automated cleaning
equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support
for details.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. EP256HA should be stabilized at room temperature prior to
printing. EP256HA should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly when held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA
Phone: (+1) 630-616-4000 • Email: [email protected] • Website: www.kester.com
Kester Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
0
20
40
60
80
100
120
140
160
180
200
220
240
0 30 60 90 120 150 180 210 240 270 300 330
Time (sec.)
Temperature (C)
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Soaking Zone
(120 sec. max.)
30-60 sec. typical
Reflow Zone
45-75 sec. typical
Peak Temp.
210 - 225 C
<1.8 C/Sec
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
[email protected]
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
[email protected]
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
[email protected]
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
EP256HA
Rev: 21Sep09
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440