Mag Layers USA GMPI-201610 F1 User Manual
Page 6
MAG.LAYERS
GMPI-201610-F1 Series
■
■
■
R
R
R
E
E
E
L
L
L
I
I
I
A
A
A
B
B
B
I
I
I
L
L
L
T
T
T
Y
Y
Y
T
T
T
E
E
E
S
S
S
T
T
T
•
MECHANICAL PERFORMANCE TEST
ITEM
SPECIFICATION
TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245
±
5
℃
Flux: Rosin
Dip Time: 3
±
1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder temperature : 260
±
5
℃
Flux: Rosin
Dip time: 10
±
1 seconds
TYPE
W(KGF)
Time (Sec)
GMPI-160808
0.6
GMPI-201205
0.8
GMPI-201209
0.6
GMPI-201610
1.0
GMPI-252005
1.5
GMPI-252010
GMPI-252012
GMPI-321608
GMPI-322510
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMPI-322512
1.0
30
±
5
TYPE
W(KGF)
Time (Sec)
GMPI-160808
GMPI-201205
GMPI-201209
GMPI-201610
1.0
GMPI-252005
GMPI-252010
GMPI-252012
GMPI-321608
GMPI-322510
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
GMPI-322512
2.0
10
±
5
TYPE
A(MM)
P(KGF)
GMPI-160808
1.0
0.6
GMPI-201205
GMPI-201209
1.4
1.0
GMPI-201610
2.0
GMPI-252005
1.0
GMPI-252010
GMPI-252012
GMPI-321608
GMPI-322510
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMPI-322512
2.0
2.0
Bending Test
Appearance: No damage
Substrate:PCB(100mm
×
40mm
×
1.6mm)
Solder: Reflow
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
W