Mag Layers USA MSI-200904CP - Manual (Page 4)

MECHANICAL
TEST ITEM SPECIFICATION
There shall be Temperature profile of reflow soldering
P.2/9 Product picture & dimensions is added no damage or
(reflow soldering) problems.
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS
Temperature △L/L20℃≦ ±10% The test shall be performed after the sample has stabilized in
characteristics 0～2000 ppm/℃
calculated based on the value applicable in a normal
temperature and narmal humidity shall be △L/L20℃≦ ±10%.
Page-4/8 MSI-200904CP-SERIES- □-□□
Sodering temperature (
℃
) soldering
(Peak temperature 260±3℃ 10 sec
Slow cooling
(Stored at room
temperature)
30 sec Min
(230 +0 ℃)
300
250
200
150
100
50
2 min
10
sec.
2 min. or more
Pre-heating
150 ~ 180℃
M AG .LA Y E R S