Mag Layers USA MSI-280904CP - Manual (Page 4)

MECHANICAL
TEST ITEM SPECIFICATION
There shall be Temperature profile of reflow soldering
Soldering heat no damage or
(reflow soldering) problems.
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS
Temperature △L/L20℃≦ ±10% The test shall be performed after the sample has stabilized in
characteristics 0～2000 ppm/℃
calculated based on the value applicable in a normal
temperature and narmal humidity shall be △L/L20℃≦ ±10%.
Page-4/8 MSI-280904CP-SERIES- □-□□
Sodering temperature (
℃
) soldering
(Peak temperature 260±3℃ 10 sec
Slow cooling
(Stored at room
temperature)
30 sec Min
(230 +0 ℃)
300
250
200
150
100
50
2 min
10
sec.
2 min. or more
Pre-heating
150 ~ 180℃
M AG .LA Y E R S