Mag Layers USA MCM-7060M - Manual (Page 3)

(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder ability The product shall be connected to the test Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm). Refer to clause 8 for Reflow profile.
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering
Soldering heat
(reflow soldering)
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength The terminal electrode and the ferrite must Solder a chip to test substrate , and then laterally apply
not damaged. a load 9.8N in the arrow direction.
Strength on PC board The terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
bending not damaged.
High
Impedance:Within ±20% of the initial value. After the samples shall be soldered onto the test circuit
temperature
Insulation resistance and DC resistance on the board,the test shall be done.
resistance
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min.
The terminal electrode and the ferrite must not Temperature : +85 ±2℃
damaged. Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500 ±12 hours
MCM-7060M-SERIES Page-3/8
M A G .L A Y E R S
Sodering temperature (
℃
) soldering
(Peak temperature 260±3℃ 10 sec
Slow cooling
(Stored at room
temperature)
30 sec Min
(230 +0 ℃)
300
250
200
150
100
50
2 min
10
sec.
2 min. or more
Pre-heating
150 ~ 180℃