Mag Layers USA MCD-855C - Manual (Page 3)

(4) RELIABILITY TEST METHOD
MECHANICAL
NO. ITEMS
1 Solderability test
2 lead tensile 1.0 Kg MIN. The lead of product is pulled with a load of
strength test 1.0kg mininum until lead breakdown. The tensile
force shall be recorded.
3 Vibration test △L/L≦ ±7% The product is fixed ento the vibration with
Visual:OK amplitude of 1.52m/m at a frequency of 10～55Hz
sweeping for lmin. The vibration is done at X,Y,
Z direction respectively for 2 houes, totally 6
hours.
4 Soldering heat Visual:OK The leads of product are dipped into a solder pot
resistance test Circuit:OK of 260 ±5℃ for a duration of 10±1sec. Nothing
particular on visual and open circuitry as a
result of ore testing.
ENVIRONMENTAL
NO. ITEMS
1 Humidity △L/L≦ ±5% The product is placed in a chamber of 40 ±2℃,
endurance 90～95%RH for 96 hours. Measurement is done
test after the reaovery of 4～24 hours.
2 High temp △L/L≦ ±5%
endurance test
3 Low temp test △L/L≦ ±5%
4 Thermal shock △L/L≦ ±5%
test
Page 3/4 MCD-855C-SERIES
CONDITIONS
The specimens are placed in a chamber and the
temp is then lowered to -20 ±2℃ for one hour.
The temp will raised to +80 ±2℃ for one hour.
This constitues one cycle. Ten cycles of such
testing shall be completed. Measurement is made
after recovery for 4～24 hours from the
completion of testing.
SPECIFICATIONS
recovery of 4～24 hours.
The product is placed in a chamber of 80 ±2℃,
for 72 hours. Measurement is done after recovery
of 4～24 hours.
SPECIFICATIONS CONDITIONS
The product is placed in a chamber of -40 ±2℃,
for 96 hours. Measurement is done after
More than 90% of the
termnial electrode
should be covered
with solder. Dipping: 245 ± 5 ℃, 3 ± 1 seconds
M AG .LAY E R S