4) reliability test method, Mag.layers, Mechanical – Mag Layers USA MSCDB-1305 User Manual
Page 3
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
SPECIFICATION
TEST DETAILS
Substrate bending
There shall be
The sample shall be soldered onto the printed circuit board
no mechanical
in figure 1 and a load applied unitil the figure in the arrow
damage or elec-
direction is made approximately 3mm.(keep time 30 seconds)
trical damege.
PCB dimension shall the page 7/9
F(Pressurization)
Vibration
△L/Lo≦
±5%
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
There shall be
and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical
be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage.
(A total of 6 hours)
Solderability
New solder
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90%
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a depth 0.5mm
below for 3
±0.2 seconds fully in molten solder M705 with
a temperature of 245
±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
Page 3/8
MSCDB-1305H-SERIES
PRESSURE ROD
figure-1
MAG.LAYERS