Mag Layers USA MHD-07EZPSERIES-XC User Manual
Page 2
MAG.LAYERS
MHD-07EZPSERIES-XC
■
■
■
P
P
P
R
R
R
O
O
O
D
D
D
U
U
U
C
C
C
T
T
T
D
D
D
I
I
I
M
M
M
E
E
E
N
N
N
S
S
S
I
I
I
O
O
O
N
N
N
NOTE
：
Dimensions in mm
PRODUCT NO.
A
B
C
D
E
MHD-07EZPSERIES-XC
7.2 ± 0.5
7.5 ± 0.5
5.0 Max
5.0± 0.3
1.5± 0.3
■
E
E
E
L
L
L
E
E
E
C
C
C
T
T
T
R
R
R
I
I
I
C
C
C
A
A
A
L
L
L
R
R
R
E
E
E
Q
Q
Q
U
U
U
I
I
I
R
R
R
E
E
E
M
M
M
E
E
E
N
N
N
T
T
T
S
S
S
R
dc
(m
Ω
)
PART NUMBER
INDUCTANCE
Lo(
μ
H)
±
20%
@0A
Typ.
Max
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS
2
MHD-07EZPR50M-XC
0.50
2.20
2.40
28.1
40.5
MHD-07EZPR74M-XC
0.74
3.25
3.57
27.1
27.8
MHD-07EZP1R0M-XC
1.0
4.20
4.60
23.1
24.0
MHD-07EZP1R5M-XC
1.5
6.00
6.60
18.8
20.0
MHD-07EZP2R2M-XC
2.2
8.30
9.15
16.3
18.0
TEST FREQUENCY: 100 KHz, 0.1V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
dc
:CH11025,GOM802 MICRO OHMMETER
NOTES:
1. DC current (I
dc
) that will cause an approximate
△
T of 40
℃
2. DC current (I
sat
) that will cause Lo to drop approximately 20%
3. All test data is referenced to 25
℃
ambient
4. Operating Temperature Range -55
℃
to +125
℃
5. The part temperature (ambient + temp rise) should not exceed 125
℃
under the worst operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
R50