Chemtronics Soder-Wick Lead-Free SD SW14045 - Manual

PRODUCT DESCRIPTION
Soder-Wick

Lead-Free is the state of the
art in desoldering technology. It is specially
designed for removal of today’s high
temperature lead-free solders. The single
layer weave used for Soder-Wick

Lead-
Free braid is lighter in mass than any other
desoldering braid available and allows for
lead-free solder removal at lower
temperatures. Soder-Wick

Lead-Free
responds faster than any other conventional
desoldering braid. This unique design
minimizes overheating and requires less
“contact” time thus preventing heat damage
to the PCB and sensitive components. For
Lead-Free rework, Soder-Wick

has the
answer.
 Fastest wicking and heat transfer
 High capacity for solder uptake
 Halide free, no corrosive residues
 Minimizes risk of heat damage to pads,
components and PBCs
 Can be used with Tin/Lead solders
 RoHS compliant
TYPICAL APPLICATIONS
Soder-Wick

Lead-Free desoldering braid
safely removes solder from:
 Thru-hole Components
 SMT Pads and BGA Pads
 Micro Circuits
 Terminals, Lugs and Posts
 Identification Script
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Flux Type High-Temperature No Clean
Type ROL0
Specifications: ANSI/IPC J STD-004
MIL-F-14256 F
No Clean Flux Spec: MIL-STD-883B
Bellcore TR-NWT-000078
ANSI/IPC J SF818
Shelflife: 2 years
Size #
Width
Inches Color
Width
Metric
2 .060” Yellow 1.5 mm
3 .080” Green 2.0 mm
4 .110” Blue 2.8 mm
STATIC DISSIPATIVE PACKAGING
Soder-Wick

Lead-Free is packaged on
Static Dissipative bobbins to minimize the
risk of damage associated with static
electricity. The static dissipative bobbins
qualify as electrostatic discharge protective
per MIL-STD-1686C and MIL-HDBK-
263B and meet the static delay rate
provision of MIL-B-81705C.
TDS # SWPbFree
CHEMTRONICS

Technical Data Sheet
Soder-Wick

Lead-Free SD Desoldering Braid