Compaq 2510p - Manual (Page 24)

Form Factor Form Factor Form Factor Form Factor PCI-Express MiniCard
Weight Weight Weight Weight 0.35 oz (10 g)
Dimensions Dimensions Dimensions Dimensions (Length x
Width x Thickness) 2.01 x 1.18 x 0.18 in (51 x 30 x 4.5 mm)
Voltage, Operating Voltage, Operating Voltage, Operating Voltage, Operating 3.3v +/- 10%
Temperature, Operating Temperature, Operating Temperature, Operating Temperature, Operating
(from TIA/EIA/IS-98-D) –22° to 140° F (–30° to 60° C) (full RF performance)
–22° to 167° F (–30° to 75° C) (reduced RF performance)
Temperature, Non- Temperature, Non- Temperature, Non- Temperature, Non-
operating, 96 hours
operating, 96 hours operating, 96 hours operating, 96 hours (from
MIL-STD 202 Method
108)
–40° to 185° F (–40° to 85° C)
Humidity, Non-operating Humidity, Non-operating Humidity, Non-operating Humidity, Non-operating 85% relative humidity for 48 hours @ 185° F (85° C) (non-condensing)
Configuration Utilities Configuration Utilities Configuration Utilities Configuration Utilities Verizon Wireless VZAccess Manager
LED Activity LED Activity LED Activity LED Activity LED Off – Radio Off;
Solid LED On – Radio On
HP hs2300 HSDPA HP hs2300 HSDPA HP hs2300 HSDPA HP hs2300 HSDPA
Broadband Wireless
Broadband Wireless Broadband Wireless Broadband Wireless
Module
Module Module Module
Frequency Bands and Frequency Bands and Frequency Bands and Frequency Bands and
Power Class
Power Class Power Class Power Class
850/1900/2100MHz WCDMA
Power class 3 (+24dBm)
850MHz GSM/GPRS/EDGE
900MHz GSM/GPRS/EDGE,
1800MHz GSM/GPRS/EDGE
1900MHz GSM/GPRS/EDGE
EDGE E2 power
GPRS/EDGE Multislot Class 12
GPRS PCS/DCS power class 1
GSM power class 4
Wireless Protocol Wireless Protocol Wireless Protocol Wireless Protocol
Standards
Standards Standards Standards
GPRS/EDGE: 3GPP R99 GERAN P1
WCDMA Release 5 (R5)
High-Speed Downlink Packet Access (HSDPA) 3.6Mbps
GSM Phase 2+
Wireless Parametric Wireless Parametric Wireless Parametric Wireless Parametric
Standards
Standards Standards Standards
Complies with 3GPP specifications
Additional Standards Additional Standards Additional Standards Additional Standards
Compliance
Compliance Compliance Compliance
FCC parts 15/22/24, CE, Microsoft WHQL, R&TTE directive 1999/5/EC
(health, safety, EMC, spectrum), GCF-CC (Module), European Union
Directive 2002/95/EC (restrictions of the use of certain Hazardous
Substances (RoHS) in electronic equipment), Infrastructure Interoperability
Testing (IOT)
Data Rates Data Rates Data Rates Data Rates
(Packet Mode) Designed maximum data rate:
EDGE 118 kbps UL / 236 kbps DL
UMTS 384 kbps UL / 384 kbps DL
HSDPA 384 kbps UL / 3.6 Mbps DL
Chipset and Module Chipset and Module Chipset and Module Chipset and Module Qualcomm MSM6280 chipset; Sierra Wireless MC8775 module
Maximum Output Power Maximum Output Power Maximum Output Power Maximum Output Power 32 dBm (+/-2) GSM/EDGE GMSK mode
Power Consumption Power Consumption Power Consumption Power Consumption
(maximum) 800mA
Power Consumption, Power Consumption, Power Consumption, Power Consumption,
Sleep Mode
Sleep Mode Sleep Mode Sleep Mode
4 – 8mA
QuickSpecs
HP Compaq 2510p Notebook PC HP Compaq 2510p Notebook PC HP Compaq 2510p Notebook PC HP Compaq 2510p Notebook PC
Technical Specifications
DA - 12717 Worldwide — Version 10 — August 10, 2007 Page 24