Emi design issues, Designing systems for emc, Emc design tips – Echelon LonWorks Twisted Pair Control Module User Manual

Page 36: O emi design issues

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Design Issues

EMI Design Issues

The high-speed digital signals associated with microcontroller designs can

generate unintentional Electromagnetic Interference (EMI). High-speed voltage

changes generate RF currents that can cause radiation from a product if a length

of wire or piece of metal can serve as an antenna.
Products that use the Twisted Pair Control Modules generally need to

demonstrate compliance with EMI limits enforced by various regulatory agencies.

In the USA, the Federal Communications Commission (FCC) requires that

unintentional radiators comply with Part 15 level “A” for industrial products, and

level “B” for products that can be used in residential environments. In Europe,

the CENELEC committee requires that unintentional radiators comply with the

EN 55022 standard. Similar regulations are imposed in most countries

throughout the world.
Echelon has designed the Twisted Pair Control Modules with low enough RF

noise levels for design into level “B” products. Echelon encourages level “B”

compliance for all L

ON

W

ORKS

compatible products. This section describes design

considerations for control module-based products to meet EMI regulations.

Designing Systems for EMC

Echelon has demonstrated that designs using the control modules can meet both

FCC and EN55022 level “B” limits. Careful design of application electronics is

important to guarantee that a control module-based node will achieve the desired

electromagnet compatibility (EMC). This section provides useful design tips for

EMC. The FT 5000, TP/FT-10, and TP/FT-10F Control Modules have been

designed to comply with IEC 61000-4-2, IEC 61000-4-3, IEC 61000-4-4, IEC

61000-4-5, and IEC 61000-4-6 standards. For more information, see the Series

5000 Chip Data Book, FTT-10 Free Topology Transceiver User's Guide, or FTT-

10A Free Topology Transceiver User's Guide, as applicable.

EMC Design Tips

The following design tips can greatly aid in EMC design:

Most of the RF noise originates in the CPU portion of the control module,

and in any high-frequency or high-speed application circuitry in the

device.

Most of the EMI will be radiated by the network cable and the power

cable.

Filtering is generally necessary to keep RF noise from getting out on the

power cable.

EMI “Keepout” area restrictions should be observed to prevent internal

RF noise from coupling onto the network cable.

The control module must be well grounded within the device to ensure

that its built-in EMI filtering works properly.

Early EMI testing of prototypes at a certified test facility is an extremely

important step in the design of level “B” products. This testing ensures

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